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Reduce Precious Metal Dependency in Data Communications Connector Manufacturing

Connector manufacturers face growing demands for faster data transfer speeds and higher power density, alongside rising precious metal costs and sustainability requirements. Xtalic’s nanostructured alloys are production ready, drop-in compatible, and validated to help manufacturers qualify new materials faster.

The Data Communications Industry Is Under Pressure to Change

Gold and platinum group metals prices have reached historic highs and experienced some of the most dramatic commodity swings in recent memory. For connector manufacturers supplying routers, switches, ethernet infrastructure, and next-generation data center hardware, precious metal spend is no longer a fixed cost. It is a volatile line item that threatens margins, complicates long-term pricing commitments, and scales directly with production volume.

At the same time, regulatory bodies, enterprise customers, and corporate sustainability teams are applying mounting pressure to reduce precious metal dependency and demonstrate cleaner supply chains. Precious metal mining carries a significant carbon footprint, and manufacturers who cannot show a credible reduction roadmap are increasingly at a disadvantage in procurement conversations.

As data speeds and power density demands rise, connector materials face increasingly stringent performance requirements. At the same time, the cost and sustainability challenges of traditional precious metal finishes are becoming harder to justify. Manufacturers need proven, qualified alternatives that deliver performance without increasing precious metal dependency or disrupting existing production.

Proven Solutions Across Every Layer of the Datacomm Stack

Routers, Switches and Network
Infrastructure Connectors

High-volume connector interfaces in network infrastructure demand stable contact resistance, corrosion resistance, and wear durability across millions of mating cycles. Gold reduction without performance compromise is the defining challenge for this segment.

XTRONIC®→

Next-Generation AI and Data Center
Connector Plating

Connectors currently using gold flash over palladium nickel represent the largest addressable opportunity for precious metal replacement in the datacomm space. A direct, EIA 364-1000 qualified replacement for this stack, without palladium, is now available.

AUREX™→

The Right Alloy for Every Datacomm Challenge

XTRONIC®

Gold Reduction Barrier Layer

Replaces nickel sulfamate as the barrier layer in connector plating stacks, enabling up to 67% reduction in gold usage while matching or exceeding the corrosion and wear performance of traditional thick-gold finishes.

AUREX™

Gold Flash PdNi Replacement

A silver-based nanocrystalline alloy that directly replaces gold flash palladium nickel in a simplified two-layer stack. Passes EIA 364-1000 test suite.

Impact at Scale

500M

Million dollars (+) in gold savings enabled across global deployments

50

High volume production lines globally

67

Reduction in gold usage with XTRONIC

100

Million kg CO₂ eq

Computational
Design

Xtalic’s nanostructured alloys are engineered using our proprietary computational design platform built to optimize material performance from the atomic level.

Engineering
Expertise

From plating stack design to the first sample to full production, Xtalic’s engineering team works alongside customers to design and ensure high performance in the final application.

Nanostructured
Alloys

By engineering metals at the atomic level, Xtalic achieves combinations of corrosion resistance, conductivity, and durability that conventional plating materials cannot match.

Scale-up and
Manufacturing

Drop-in compatible with existing plating infrastructure. Pilot production available through our Technical Center to ensure process integration and high-volume manufacturing.

Get Started

Over 20 Years of Advancing Materials at the Atomic Level

From sampling to full production, Xtalic’s engineering team is ready to help you find the right solution for your most demanding manufacturing challenges.

Talk to an Expert