Intro Video
Tech Video
Tech Paper
降低连接器之成本应用

Precious Metal Reduction

Xtalic designs interconnect contact surface solutions that deliver equivalent or better performance while lowering precious metal costs. Gold is commonly used on connectors to provide a low-resistance, stable electrical connection. A nickel barrier layer is used to provide corrosion protection to improve durability and prevent interdiffusion between the gold and copper connections. When introduced as a barrier layer, XTRONIC®, is both a more corrosion- and wear-resistant solution, allowing the use of less gold at the contact interface.

Our Performance

XTRONIC®, our wear-resistant nanostructured alloy,  provides excellent substrate protection. In high-performance applications, XTRONIC® enables our customers to use less precious metal — for savings of up to 40%. XTRONIC® passes the testing according to Telcordia GR-1217-core Central Office qualification requirements. Below: XTRONIC® outperforms the standard barrier layer in terms of both corrosion and wear.

Barrier Layer Porosity and Corrosion Test: 75-minute Nitric Acid Vapor Test

As-plated Industry Standard .75μm Au/1.5μm NiS:

Before NAV exposure.

Industry Standard .75μm Au/1.5μm NiS:
Heavy corrosion due to porosity in the barrier layer.

.25μm Au/.75μm XTRONIC®:
Minimal discoloration, low porosity & high corrosion resistance.

Contact Profiles After 10K Mating Cycles

Industry Standard .75μm Au/NiS:
Heavy wear is seen at the interface.

.75μm Au/XTRONIC®:
Minimal wear is seen at the interface.