Xtalic’s electroplated barrier layer enables a dramatic reduction in the thickness of the gold layer when plating electronics such as connectors, semiconductors, microelectronics, IC packages, Smart Cards, Memory Cards and PCB tabs
Superior Barrier Layer Allows Much Thinner Gold Layer
Xtalic offers a replacement for the standard nickel barrier layers on connectors and in other electronic applications between copper and the electroplated hard gold. With Xtalic’s XTRONICTM process a much thinner layer of hard gold can be plated. You can lower costs by using substantially thinner coatings of gold and without affecting performance: the superior physical properties of the XTRONICTM coating maintain or improve overall conformance to industry standard tests for corrosion resistance, copper migration protection and wear. The Xtalic barrier layer can also be used beneath other precious metals such as palladium.
Electroplated Alloy Coating Suitable for High Speed Application
The Xtalic coating is an electroplated coating and it can be applied using standard high speed reel-to-reel, tab plating or other electroplating processes. It is a nanostructured alloy of nickel and tungsten.
Better Corrosion Resistance, Less Copper Migration and Better Wear Resistance
It is significantly more corrosion resistant than standard nickel barrier layers. The fine structure of the Xtalic coating does and excellent job of preventing copper from migrating up to the surface of the gold. And the hardness of the Xtalic coating helps to improve the wear of the gold or other precious metal top layer.
Significant Savings from Large Reduction in Gold Consumption
Achieve significant gold reduction by using Xtalic’s process on a wide array of electronic parts and applications while maintaining or even improving technical performance.