HAVE A QUESTION?XTRONIC®
The XTRONIC barrier layer delivers dramatic performance improvement in corrosion resistance and wear improvement and enables significant gold reduction on a wide range of electronics components including connectors, semiconductors, microelectronics, IC packages, Smart Cards, Memory Cards and PCB tabs.
XTRONIC can accomplish this performance advantage in just 40% of the thickness of the process of record.
The XTRONIC layer is thinner and has a much finer grain structure - so fine that it cannot be resolved in this image.
Ni-Sulfamate barrier layer
Grain structure is micrometer-scale
| XTRONIC® BL barrier layer Grain structure is too fine to be resolved (< 20 nm) |
XTRONIC material resists corrosion and prevents substrate corrosion far better than the existing process.
Surface Comparison after 30 min of industry standard* corrosion test:
XTRONIC BL has superior wear properties for multiple insertion applications.
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